English | Chinese | Japanese
 
 
Products details
 

 Contact Us:
  home>> Products>>>Sputtering Targets


Sputtering targets, Foil, Rod, Wire, Bar, Sheet, Plate, etc.


Description
Aluminum oxide sputtering target 99.99% (metal basis) Al2O3
Barium titanium oxide sputtering target 99.9% (metals basis excluding Sr)  
Boron carbide sputtering target 99.5% (metal basis)  
Boron nitride sputtering target 99.99% (metals basis excluding Ca)  
Boron nitride sputtering target 99.99% (metals basis)  
Calcium fluoride sputtering target 99.95% (metal basis)  
Chromium(III) oxide sputtering target 99.8% (metals basis)  
Copper indium selenide sputtering target 99.99% (metal basis)  
Copper indium gallium sputtering target 99.99% (metal basis)  
Copper indium gallium selenide sputtering target 99.99% (metal basis)  
Gallium sputtering target 99.99% (metal basis)  
Germanium(II) Telluride 99.99% GeTe
Hafnium(IV) oxide sputtering target 99.95% (metals basis excluding Zr)  
Indium sputtering target 99.99% (metal basis)  
Indium sulphide sputtering target 99.99% (metals basis)  
Indium tin oxide sputtering target 99.99% (metals basis)  
Lead zirconium titanium oxide sputtering target 99.9% (metals basis)  
Magnesium oxide sputtering target 99.95% (metals basis excluding Ca)  
Molybdenum sputtering target 99.999% (metal basis)  
Molybdenum silicide sputtering target 99.5% (metals basis)  
Niobium(V) oxide sputtering target 99.95% (metals basis)  
Selenium sputtering target 99.99% (metals basis)  
Silicon carbide sputtering target 99.5% (metals basis excluding B)  
Silicon(IV) nitride, MgO binder, sputtering target 99.9% (metals basis)  
Silicon(II) oxide sputtering target 99.9% (metals basis)  
Silicon(IV) oxide sputtering target 99.995% (metals basis)  
Silver sputtering target 99.99% (metal basis)  
Tantalum carbide sputtering target 99.5% (metals basis)  
Tantalum(V) oxide sputtering target 99.9% (metals basis)  
Titanium carbide sputtering target 99.5% (metals basis)  
Titanium nitride sputtering target 99.5% (metals basis)  
Titanium silicide sputtering target 99.5% (metals basis)  
Tin(II)Telluride 99.99+% SnTe
Zinc oxide sputtering target 99.9% - 99.999% (metals basis)  
Nickel Chromium, sputtering target 99.95% (metals basis)  
Nickel Iron, sputtering target 99.95% (metals basis)  
Nickel Vanadium, sputtering target 99.95% (metals basis)  
Aluminum sputtering target 99.999% (metals basis)  
Carbon sputtering target 99.999% (metals basis)  
     
     
     
     
     
     
     
     
     
     
     
     
     
 
 
Home | about | contact | sitemap
Head office:Unit 1001, Fourseas Building, 208-212 Nathan Rd, KL, HONG KONG Shenzhen Office: Room 402-406, 13rd building, Chuangye road, Nanshan, Shenzhen, China. Tel: +86-755-89801091. Fax: +86-755-86058970
Copyright 2001-2011 NaBond Technologies Co., Limited All Rights Reserved