Products

Copper Nanopowder (Cu nanopowder)
Product Name: Copper Nanopowder
Formula: Cu
Purity: 99.9+%
Average particle size: ≈25 nm (0-60nm )
BET specific surface area: 30-50 m2/g

Production process

 

NaBond_Copper nanoparticle is produced by laser evaporation process. The raw material used is high purity Copper. This process enables us to make high purity, small particle size, high active Copper nanoparticles in large quantity and low cost.

 

Applications

 

Conductive slurry -The electronic size with good performance made of copper nanoparticle instead of valuable metal particles cuts cost to a large extent. This technology is used to the preference of microelectronic processes.

 

The superficial conductive coating processing of metal and non-ferrous metal-Due to their high-activity surface, aluminum, copper and nickel nanoarticle can coat under oxygen-free condition below smelting point of the particles. This technology can be adopted in the manufacture of microelectronic devices.

 

Dispersion technology reference

 

We will be happy to provide some papers on dispersion technology. Please let us know some details of your application, we will send you some references.

 

Inquire for this product at info@nabond.com

Tel:+86-755-89801091

Fax:+86-755-86058970